Electrolytic copper foil It refers to the metal copper foil produced by electrolysis with copper as the main raw material. Electrolytic copper foil is one of the important raw materials in the manufacture of copper clad plate, printed circuit board and lithium ion battery. Data shows that from 2015 to 2018, the growth rate of China's PCB output value was significantly higher than that of the global PCB industry. In 2018, China's PCB output value reached US $32.7 billion. In 2019, China's PCB industry was affected by macroeconomic fluctuations, with an output value of US $32.94 billion, up 0.7% year on year, and the growth rate declined. China Commercial Industry Research Institute predicts that the output value of China's PCB industry will reach 36.75 billion US dollars in 2021.

PCB industry growth drives the development of standard copper foil

Thanks to the steady growth of China's PCB industry, the output of China's standard copper foil has always been growing. According to CCFA data, the output of China's standard copper foil in 2019 was 292000 tons, up 5.8% year on year. However, the production of standard copper foil in China is mainly medium and low-end products, and high-end standard copper foil still depends on imports to a certain extent. In recent years, with the progress of China's copper foil production technology, the product quality is also constantly improving, which is expected to gradually penetrate into the high-end product market in the future.

Demand growth, penetration into high-end market

With the growth of China's PCB industry's demand for standard copper foil, the gradual penetration of China's copper foil into the high-end product market, and the gradual release of China's new capacity in recent years, the output of China's standard copper foil will continue to grow steadily in the next few years. Data shows that the output of China's standard copper foil will be 292000 tons in 2019, and it is predicted that the output of China's standard copper foil will reach 312000 tons in 2020.

Development trend of standard copper foil industry

1. Multilayer, thin and high-density PCB boards promote the upgrading of standard copper foil technology and products

At present, 3C electronic devices such as smart phones and tablet computers continue to develop in the direction of thinness and integration. In order to achieve the goal of less space, higher speed and more functions, their requirements for multi-layer, thin and high-density PCBs are increasingly high. PCB board is evolving towards smaller size and higher integration, which also promotes the upgrading of standard copper foil technology and products.

2. 5G communication drives the growth of high-frequency high-speed PCB and the demand growth of high-performance standard copper foil

5G communication needs faster transmission rate, wider network spectrum and higher communication quality, so 5G communication equipment will have more stringent performance requirements for high-frequency communication materials. The antenna system in mobile communication base stations needs high-frequency high-speed PCB and CCL substrates, which will drive the growth of demand for standard copper foil with relevant characteristics.