The annealing treatment in the copper foil preparation process has the following functions:

Internal stress relief: In the process of copper foil preparation, due to cold rolling and other processing operations, the internal stress of copper foil will be generated, and annealing can be eliminated by heat treatment. This is very important for improving the mechanical properties of the copper foil, which can avoid

Crack or deformation caused by stress.

Improving crystallinity: the copper foil grain size will become smaller during cold rolling, and annealing treatment can increase the crystallinity of copper foil by providing heat energy to make the grain grow. The growth of grains can improve the physical properties of materials, such as strength

Hardness and conductivity, etc., can also improve the ductility of copper foil.

Improving mechanical properties: annealing treatment can make copper foil soft and improve its plasticity and ductility. The softening process of copper foil is realized by the complex movement and deformation of the crystal boundary during heat treatment. Softened copper foil is easier for secondary processing

Operation, such as bending, folding, stretching, etc.

Provide uniform microstructure: during the preparation of copper foil, processing operations such as cold rolling will lead to nonuniformity of microstructure. Annealing can adjust the microstructure by controlling the annealing temperature and time to make it more uniform.

Uniform microstructure can improve the mechanical and physical properties of copper foil, such as hardness, strength and conductivity.

Enhanced corrosion resistance: annealing treatment can eliminate the oxide layer on the surface of copper foil, making its surface smoother. Smooth surface can reduce the possibility of surface damage and oxidation, thus improving the corrosion resistance of copper foil. Annealing treatment can also make copper foil

The surface is easier to contact with other materials, improving its welding performance with other materials.

Improving dimensional stability: during the preparation of copper foil, due to the size change of copper foil caused by cold rolling and other processing operations, annealing can improve the dimensional stability of copper foil through heat treatment and crystal growth. Dimensional stability refers to copper foil

The ability to maintain its shape and size under environmental factors such as temperature and humidity changes. Dimensional stability is very important for applications requiring high-precision dimensions, such as electronic components, solar cells, etc.

In summary, annealing treatment in copper foil preparation process mainly includes eliminating internal stress, improving crystallinity, improving mechanical properties, providing uniform microstructure, enhancing corrosion resistance and improving dimensional stability. Annealing treatment can make copper foil

It has better physical, mechanical and chemical properties and improves its application value in various fields.