Copper foil: a kind of negative electrolytic material. It is a thin, continuous metal foil deposited on the base layer of circuit board. It serves as the conductor of PCB. It is easy to bond to the insulating layer, accept the printing protective layer, and form the circuit pattern after corrosion. Copper mirror test: a kind of flux corrosion test, using a vacuum precipitation film on the glass plate.
Copper foil is made of copper plus other metals in a certain proportion. Generally, there are two types of copper foil, 90 foil and 88 foil, namely, 90% and 88% copper content, and the size is 16 * 16cm. Copper foil is the most widely used decorative material. For example: hotels, temples, Buddha statues, gold lettered signboards, tile mosaics, handicrafts, etc.
Copper foil has the characteristics of low surface oxygen, which can be attached to various substrates, such as metals, insulating materials, etc., and has a wide range of temperature applications. It is mainly used for electromagnetic shielding and anti-static. The conductive copper foil is placed on the substrate and combined with the metal substrate, which has excellent conductivity and provides electromagnetic shielding effect. It can be divided into: self-adhesive copper foil, double conductive copper foil, single conductive copper foil, etc.
Electronic grade copper foil (purity of more than 99.7%, thickness of 5um-105um) is one of the basic materials of electronic industry. The electronic information industry is developing rapidly. The use of electronic grade copper foil is increasing. The products are widely used in industrial calculators, communication equipment, QA equipment, lithium-ion batteries, civil television, video recorders, CD players, photocopiers, telephones, air conditioners Electronic parts for automobiles, game consoles, etc. The demand for electronic grade copper foil, especially high-performance electronic grade copper foil, is increasing in the domestic and foreign markets. Relevant professional institutions predict that by 2015, China's domestic demand for electronic grade copper foil will reach 300000 tons, and China will become a manufacturing base for printed circuit boards and copper foil in the world. The market for electronic grade copper foil, especially high-performance foil, is promising.
Industrial copper foil can be divided into Calendered copper foil (RA copper foil) and dot splitting copper foil (ED copper foil), among which the calendered copper foil has good ductility and other characteristics, and is used in the early process of soft plate manufacturing Electrolytic copper foil It has the advantage of lower manufacturing cost than calendered copper foil. As calendered copper foil is an important raw material for soft board, the property improvement and price change of calendered copper foil have a certain impact on the soft board industry.
Since there are few manufacturers of calendered copper foil and the technology is also in the hands of some manufacturers, customers have a low grasp of the price and supply, so it is feasible to replace calendered copper foil with electrolytic copper foil without affecting the product performance. However, if the physical characteristics of the copper foil structure will affect the etching in the next few years, the importance of calendered copper foil will rise again in the thin and thin products and high-frequency products due to telecommunications considerations.
There are two obstacles in the production of calendered copper foil, resource and technology. The resource barrier means that the production of rolled copper foil needs the support of copper raw materials, which is very important to occupy resources. On the other hand, technical barriers deter more new entrants. In addition to calendering technology, surface treatment or oxidation treatment technology is also. Most of the world's major manufacturers have many technology patents and key technologies, increasing barriers to entry. If the new entrants are subject to post harvest processing and production, and are subject to the cost constraint of large manufacturers, it is not easy to successfully join the market, so the global calendered copper foil still belongs to the exclusive market.
Copper foil is an important material for manufacturing copper clad laminate (CCL) and printed circuit board (PCB). In today's rapid development of electronic information industry, electrolytic copper foil is called "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of China's printed circuit boards has become the third largest country in the world. As a PCB substrate material, copper clad laminate has also become the third largest producer in the world. As a result, China's electrolytic copper foil industry has developed by leaps and bounds in recent years. In order to understand and understand the past, present and future of the world and China's electrolytic copper foil industry, experts from China Epoxy Resin Industry Association reviewed its development.
From the perspective of the production department and market development of electrolytic copper foil industry, its development can be divided into three development periods: the period when the United States established the first world copper foil enterprise and the electrolytic copper foil industry started; The period when Japanese copper foil enterprises monopolized the world market; The period when the world is multipolar and competes for the market.
