Electrolytic copper foil As one of the basic materials of the electronic industry, it is widely used in the electronic industry and plays a very important role in the development of the entire electronic industry. Electrolytic copper foil is a metal copper deposition layer obtained by electrodeposition technology under the action of a proper electrolyte solution and a certain current density. It is widely used in the production of copper clad plate (CCL) printed circuit board (PCB). The quality of electrolytic copper foil is not only related to the raw foil matrix, but also closely related to the surface treatment technology of copper foil. The electrolytic copper foil can effectively improve the quality and performance of the product after being treated by the appropriate surface treatment process, so that it has excellent heat resistance, corrosion resistance and high stripping to meet the higher requirements of industrial production.

The development of electrolytic copper foil can be divided into three stages: the initial stage of development (1955-1970), during which copper foil for printed circuit board was produced with a thickness of 70~100um. During the rapid development period (1970-2000), 18-35um copper foil appeared in the market and was monopolized by Japanese copper foil enterprises. In the mature development period (from 2000 to now), it mainly produces 8~12um copper foil and applies it to batteries. All countries in the world have made research progress in this regard to varying degrees.

In recent years, domestic copper foil manufacturers have made great improvements in copper foil production process and product quality, but there is still a considerable gap compared with Japan, an international advanced copper foil manufacturer. The imported copper foil in China is mainly high-grade copper foil, while more than 90% of the exported copper foil is low-grade copper foil. The copper foil for the inner layer of high-density interconnection board (HDI) and the copper foil for flexible circuit board (FPC) with high technology and added value are almost all imported from Japan, South Korea, Taiwan and other places. Due to the material processing precision, the raw foil machine purchased by domestic copper foil manufacturers has poor material surface condition after a long period of continuous operation, leading to the decline of copper foil quality. For these enterprises, in order to further improve the performance and quality of copper foil products, the effective way is to study and improve the surface treatment process of electrolytic copper foil.

At present, the surface treatment process and process parameters adopted by various copper foil manufacturers at home and abroad are different, but generally they include three treatment processes: roughening, heat resistance and oxidation resistance. The common process of electrolytic copper foil surface treatment can be summarized as follows: pretreatment of the original foil (raw foil) - roughening - curing - electroplating of dissimilar metals (alloying degree) oxidation resistance - silane treatment - drying.

High end circuit boards and copper foil for lithium batteries are still technically difficult, and the product has high added value. As an indispensable raw material for power lithium batteries, copper foil, Lithium copper foil With the explosion of the new energy vehicle market, the demand continues to increase, so the development trend of the copper foil industry must be the industrialization of ultra-thin electronic copper foil products.