Taizhou Preferred Copper Foil Processing
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above is required to be 300ram × No more than 8 penetration points within 300mm area; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
Taizhou Preferred Copper Foil Processing
Copper foil can be divided into calendered copper foil and electrolytic copper foil, which are mainly used for flexible printed circuits and other special purposes. In the production of clad laminates, a large number of applications are. As for the purity of copper, IEC-249-34 and Chinese standards stipulate that it shall not be lower than 99.8%.
Taizhou Preferred Copper Foil Processing
Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.
Taizhou Preferred Copper Foil Processing
Copper foil is not a traditional metal copper product. It combines design concepts such as composite material and nano material technology, and different internal microstructures, resulting in different properties from traditional pure copper. The application of copper foil mainly focuses on the characteristics of conduction, heat conduction and electromagnetic wave shielding.
Taizhou Preferred Copper Foil Processing
Electronic circuit copper foil plays an important role in conducting electricity and heat in printed circuit board (PCB), and is known as the neural network on PCB. At present, copper foil for electronic circuits (PCB copper foil) is divided into two categories, namely conventional copper foil and high-performance copper foil.
