Wuhu selects ultra-thin copper foil manufacturers
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality.
Wuhu selects ultra-thin copper foil manufacturers
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Wuhu selects ultra-thin copper foil manufacturers
Backward key production equipment: for high-quality products with production thickness less than 0.05mm, multi roll rolling mill with width meeting user requirements shall be used. The rolling mill of some domestic copper processing plants can not be normally put into rolling foil production due to the lack of other equipment or the traditional product structure in the factory. However, some small processing plants have to use outdated production equipment and processes due to lack of key equipment or investment capacity, and copper foil product specifications and technical indicators are inferior to foreign products.
Wuhu selects ultra-thin copper foil manufacturers
The foil of the clad plate can be copper, nickel, aluminum and other metal foils. However, considering such factors as the conductivity, solderability, elongation, adhesion to the substrate and price of gold, it is considered appropriate except for special purposes.
Wuhu selects ultra-thin copper foil manufacturers
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
