Copper Foil Processing of Quzhou Preferred Circuit Board
Calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than those of electrolytic copper foil, and the copper purity is also higher than that of electrolytic copper foil.
Copper Foil Processing of Quzhou Preferred Circuit Board
The production of extremely thin copper foil has high barriers, and the products produced still need to meet many requirements of downstream lithium ion battery manufacturers. For investors, they should not only focus on the single index of thickness, not all manufacturers produce 6 μ M Copper foil is consistent, and the thinner the better.
Copper Foil Processing of Quzhou Preferred Circuit Board
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
Copper Foil Processing of Quzhou Preferred Circuit Board
Copper foil can be divided into calendered copper foil and electrolytic copper foil, which are mainly used for flexible printed circuits and other special purposes. In the production of clad laminates, a large number of applications are. As for the purity of copper, IEC-249-34 and Chinese standards stipulate that it shall not be lower than 99.8%.
Copper Foil Processing of Quzhou Preferred Circuit Board
In order to improve the adhesion strength of copper foil to the substrate, Generally, oxidation (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is generated on the surface, which improves the bonding strength of the copper foil and the substrate due to the polarity) or roughening copper foil (using electrochemical methods to generate a layer of roughening layer on the surface of the copper foil, which increases the surface area of the copper foil, and improves the bonding strength of the copper foil and the substrate due to the anchoring effect of the roughening layer on the substrate) is used.
