Huai'an chooses the best copper foil manufacturer
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Huai'an chooses the best copper foil manufacturer
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
Huai'an chooses the best copper foil manufacturer
Copper foil can be divided into many kinds according to different classifications. According to the thickness, it can be divided into: thickness (more than 70 μ m) Regular thickness copper foil (more than 18 μ M but less than 70 μ m) Thin copper foil (more than 12 μ M but less than 18 μ m) Ultra thin copper foil (less than 12 μ m) Etc.
Huai'an chooses the best copper foil manufacturer
Copper foil is a key conductive material in lithium ion batteries and printed circuit boards. It is a kind of negative electrolytic material, a thin, continuous metal foil deposited on the substrate of circuit board.
Huai'an chooses the best copper foil manufacturer
Calendered copper foil is the original foil made from copper plate by repeated rolling, and then roughened according to requirements. Due to the limitation of processing technology, its width is difficult to meet the requirements of rigid copper clad laminate, so calendered copper foil is rarely used on rigid copper clad laminate; However, because the bending resistance and elastic coefficient are greater than electrolytic copper foil, they are often used on flexible copper clad laminate.
