Shangrao optimized conductive copper foil processing
In order to improve the adhesion strength of copper foil to the substrate, Generally, oxidation (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is generated on the surface, which improves the bonding strength of the copper foil and the substrate due to the polarity) or roughening copper foil (using electrochemical methods to generate a layer of roughening layer on the surface of the copper foil, which increases the surface area of the copper foil, and improves the bonding strength of the copper foil and the substrate due to the anchoring effect of the roughening layer on the substrate) is used.
Shangrao optimized conductive copper foil processing
Copper foil can also be divided into: single-sided treatment (single-sided hair), double-sided treatment (double-sided thick), smooth treatment (double-sided hair), double-sided light copper foil (double-sided hair) and very low profile copper foil (VLP copper foil) according to the surface condition. Post copper foil can be divided into electrolytic copper foil and calendered copper foil according to different production methods.
Shangrao optimized conductive copper foil processing
Silane coupling agent treatment: after anti oxidation treatment, the surface is sprayed with silane, which can improve the oxidation resistance at room temperature on the one hand; On the other hand, in high temperature pressing plate, silane can better combine copper foil and resin substrate through coupling, and improve peel strength. Post treatment process - drying. In order to prevent the harm of residual moisture, it must be dried at not less than 100 ℃ later, and the drying temperature cannot be too high.
Shangrao optimized conductive copper foil processing
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
