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Lu'an preferred copper foil manufacturer

Release time: 2023-09-16 00:25:49
 Lu'an preferred copper foil manufacturer

Lu'an preferred copper foil manufacturer

Most copper foils used for domestic printed boards are 35um thick, and 50um copper foils are used as transition products. In high-precision hole metallized double-sided or multilayer board manufacturing, thinner than 35um copper foils, such as 18um, 9um and 5um copper foils, are expected. Some multilayer boards use thicker copper foil, such as 70um.

 Lu'an preferred copper foil manufacturer

Lu'an preferred copper foil manufacturer

The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the principle of plastic processing. Its internal structure is lamellar crystal structure, and the product has good ductility. At present, it is mainly used in the production of rigid circuit boards, while the rolled copper foil is mainly used in flexible and high-frequency circuit boards.

 Lu'an preferred copper foil manufacturer

Lu'an preferred copper foil manufacturer

Electronic circuit copper foil plays an important role in conducting electricity and heat in printed circuit board (PCB), and is known as the neural network on PCB. At present, copper foil for electronic circuits (PCB copper foil) is divided into two categories, namely conventional copper foil and high-performance copper foil.

 Lu'an preferred copper foil manufacturer

Lu'an preferred copper foil manufacturer

In order to improve the bonding strength of copper foil to the substrate, oxidation is usually used (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is formed on the surface, which improves the bonding strength of copper foil and substrate due to the polarity) Or roughen the copper foil (a roughened layer is generated on the surface of the copper foil by electrochemical method, which increases the surface area of the copper foil and improves the bonding strength between the copper foil and the substrate due to the anchoring effect of the roughened layer on the substrate).