Optimal pcb copper foil processing in fuzhou
The air supply of general air conditioning has a large impact. For the stains caused by the dirty electrolyte, the filtering of electrolyte should be strengthened. After being transferred from the electrolytic cell, the copper foil must be washed with electrolyte, because the surface of the copper foil is attached with organic matter or other impurities. The water pressure of copper foil washing must have enough pressure and a certain amount of water.
Optimal pcb copper foil processing in fuzhou
The production of extremely thin copper foil has high barriers, and the products produced still need to meet many requirements of downstream lithium ion battery manufacturers. For investors, they should not only focus on the single index of thickness, not all manufacturers produce 6 μ M Copper foil is consistent, and the thinner the better.
Optimal pcb copper foil processing in fuzhou
Most copper foils used for domestic printed boards are 35um thick, and 50um copper foils are used as transition products. In high-precision hole metallized double-sided or multilayer board manufacturing, thinner than 35um copper foils, such as 18um, 9um and 5um copper foils, are expected. Some multilayer boards use thicker copper foil, such as 70um.
Optimal pcb copper foil processing in fuzhou
Copper foil is not a traditional metal copper product. It combines design concepts such as composite material and nano material technology, and different internal microstructures, resulting in different properties from traditional pure copper. The application of copper foil mainly focuses on the characteristics of conduction, heat conduction and electromagnetic wave shielding.
Optimal pcb copper foil processing in fuzhou
Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.
