Chizhou Optimized Ultra thin Copper Foil Processing
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Chizhou Optimized Ultra thin Copper Foil Processing
High end lithium battery copper foil needs to meet the requirements of high energy density, high safety, lightweight and other characteristics of power batteries, which is also the development trend of power batteries in the future. In order to meet the above characteristics, thinner lithium copper foil means smaller resistance, so the energy density and other performance of the battery will be improved. Moreover, the thinner the copper foil of lithium battery is, the lighter the weight of the corresponding battery will be.
Chizhou Optimized Ultra thin Copper Foil Processing
Copper foil is divided into calendered copper foil and electrolytic copper foil according to the preparation process, which accounts for the vast majority of the market. According to the Copper Foil Branch of China Electricity Association (CCFA), at present, domestic manufacturers mainly focus on the production of electrolytic copper foil. In 19 years, the domestic production capacity of electrolytic copper foil is expected to be close to 600000 tons, while that of rolled copper foil is only about 10000 tons.
Chizhou Optimized Ultra thin Copper Foil Processing
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
Chizhou Optimized Ultra thin Copper Foil Processing
Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.
Chizhou Optimized Ultra thin Copper Foil Processing
Although the thickness of copper foil gradually becomes thinner, power battery manufacturers use 6 μ When the product is less than or equal to m, the coating machine, winding machine and other key equipment as well as the technological level cannot solve the problems such as wrinkles, belt breakage and high-temperature oxidation encountered in the production process, which leads to the inability to mass produce ultra-thin copper foil with high yield.
