Xuzhou Preferred Circuit Board Copper Foil Price
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Xuzhou Preferred Circuit Board Copper Foil Price
Surface passivation: chromate (or chromate and zinc salt) solution is used for surface passivation (i.e. anti oxidation treatment) after the barrier layer is plated to form a complex film with chromium (or chromium zinc) as the main body on the surface, so that the copper foil will not be oxidized and discolored due to direct contact with air, and at the same time, the heat resistance of the copper foil is improved (higher zinc content, better heat resistance), The storage period of copper foil can reach 3 months.
Xuzhou Preferred Circuit Board Copper Foil Price
The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the principle of plastic processing. Its internal structure is lamellar crystal structure, and the product has good ductility. At present, it is mainly used in the production of rigid circuit boards, while the rolled copper foil is mainly used in flexible and high-frequency circuit boards.
Xuzhou Preferred Circuit Board Copper Foil Price
Backward key production equipment: for high-quality products with production thickness less than 0.05mm, multi roll rolling mill with width meeting user requirements shall be used. The rolling mill of some domestic copper processing plants can not be normally put into rolling foil production due to the lack of other equipment or the traditional product structure in the factory. However, some small processing plants have to use outdated production equipment and processes due to lack of key equipment or investment capacity, and copper foil product specifications and technical indicators are inferior to foreign products.
