Shaoxing chooses pcb copper foil price
Ultra thin copper foil is used for portable electronic products such as mobile phones and laptops. Multilayer boards containing micro buried and blind vials and BGA, CSP and other organic resin packaging substrates are used to promote thin foil and ultra-thin foil. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Shaoxing chooses pcb copper foil price
Definition of electrolytic copper foil: it is formed by depositing copper ions in electrolyte on the round cathode roller of smooth rotating stainless steel plate (or titanium plate). The surface close to the cathode roller is called smooth surface, and the other surface is called rough surface.
Shaoxing chooses pcb copper foil price
Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.
Shaoxing chooses pcb copper foil price
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above shall not exceed 8 penetration points within the area of 300ram × 300mm; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
