Huizhou Preferred Double Conductive Copper Foil Price
In order to improve the bonding strength of copper foil to the substrate, oxidation is usually used (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is formed on the surface, which improves the bonding strength of copper foil and substrate due to the polarity) Or roughen the copper foil (a roughened layer is generated on the surface of the copper foil by electrochemical method, which increases the surface area of the copper foil and improves the bonding strength between the copper foil and the substrate due to the anchoring effect of the roughened layer on the substrate).
Huizhou Preferred Double Conductive Copper Foil Price
The commonly used reinforcement materials of copper clad laminate are alkali free (alkali metal oxide content shall not exceed 0.5%) glass fiber products (such as glass cloth, glass felt) or paper (such as wood pulp paper, bleached wood pulp paper, cotton wool paper). Therefore, laminates can be divided into glass cloth base and paper base.
Huizhou Preferred Double Conductive Copper Foil Price
Most copper foils used for domestic printed boards are 35um thick, and 50um copper foils are used as transition products. In high-precision hole metallized double-sided or multilayer board manufacturing, thinner than 35um copper foils, such as 18um, 9um and 5um copper foils, are expected. Some multilayer boards use thicker copper foil, such as 70um.
Huizhou Preferred Double Conductive Copper Foil Price
The foil of the clad plate can be copper, nickel, aluminum and other metal foils. However, considering such factors as the conductivity, solderability, elongation, adhesion to the substrate and price of gold, it is considered appropriate except for special purposes.
Huizhou Preferred Double Conductive Copper Foil Price
The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the principle of plastic processing. Its internal structure is lamellar crystal structure, and the product has good ductility. At present, it is mainly used in the production of rigid circuit boards, while the rolled copper foil is mainly used in flexible and high-frequency circuit boards.
