Current label: Copper foil
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High precision calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strips (usually less than 150 microns in thickness) based on the principle of plastic processing (usually between 4-100 microns in thickness and less than 800 mm in width). Its ductility, bending resistance and conductivity are better than electrolytic copper foil, and its copper purity is also higher than electrolytic copper foil. Copper foil is used to make printed circuit board (P
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Electronically calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strips (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than electrolytic copper foil, and its copper purity is also higher than electrolytic copper foil. Copper foil is used to make printed circuit board (P
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The calendered copper foil for graphene is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually between 4-100 microns in thickness and less than 800 mm in width). Its ductility, bending resistance and conductivity are better than electrolytic copper foil, and the copper purity is also higher than electrolytic copper foil. Copper foil is used to make printed circuit board
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Alloy calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strips (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than electrolytic copper foil, and the copper purity is also higher than electrolytic copper foil. Copper foil is used to make printed circuit board (P
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Oxygen free calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are superior to electrolytic copper foil, and the copper purity is also higher than electrolytic copper foil. Copper foil is used to make printed circuit board（
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T2 calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the plastic processing principle (usually between 4-100 microns in thickness and less than 800 mm in width). Its ductility, bending resistance and conductivity are better than those of electrolytic copper foil, and its copper purity is also higher than that of electrolytic copper foil. Copper foil is used to make printed circuit board (P
