For pcb Calendered copper foil It is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than Electrolytic copper foil The purity of copper is also higher than that of electrolytic copper foil.

Copper foil is an indispensable raw material for making printed circuit board (PCB), copper clad plate (CCL) and lithium-ion battery. Industrial copper foil can be divided into calendered copper foil and electrolytic copper foil according to its manufacturing process. Electrolytic copper foil is made by electrolysis of copper based on electrochemical principle. The internal structure of raw foil is vertical acicular crystal structure, and its production cost is relatively low. The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the plastic processing principle. Its internal structure is lamellar crystal structure, and the calendered copper foil has good ductility. At present, electrolytic copper foil is mainly used in the production of rigid circuit boards, while rolled copper foil is mainly used in flexible and high-frequency circuit boards.

Rolled copper foil is widely used in flexible copper clad plate (FCCL), flexible circuit board (FPC), 5G communication, 6G communication, electromagnetic shielding, heat dissipation substrate, graphene film preparation, aerospace, lithium battery, LED, smart cars, drones, wearable electronic products and other industries.