Wenzhou Preferred Circuit Board Copper Foil Price
The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the principle of plastic processing. Its internal structure is lamellar crystal structure, and the product has good ductility. At present, it is mainly used in the production of rigid circuit boards, while the rolled copper foil is mainly used in flexible and high-frequency circuit boards.
Wenzhou Preferred Circuit Board Copper Foil Price
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
Wenzhou Preferred Circuit Board Copper Foil Price
If the rough surface and pinholes appear at the same time when there are stains on the rough surface, it indicates that the stains are caused by the dirty electrolyte, and the dirt is attached to the copper foil in the electrolytic cell. If there are stains on the rough surface, the copper foil is not rough and there are no pinholes, it means that the workshop production environment is dirty, the air contains dust, or other suspended impurities fall on the surface of the copper foil.
Wenzhou Preferred Circuit Board Copper Foil Price
With electrolytic copper or wire return material of equal purity as raw material, it is dissolved in the solution containing copper sulfate. Electrolysis is carried out in an electrolytic cell with insoluble material as anode and cathode roller immersed in copper sulfate electrolyte at constant speed as cathode. Copper in the solution is deposited on the surface of cathode roller to form copper foil. The thickness is controlled by cathode current density and cathode roller speed. After the roller rotates out of the liquid level, it is continuously stripped from the cathode roll, washed, dried and rolled to generate the original foil.
Wenzhou Preferred Circuit Board Copper Foil Price
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Wenzhou Preferred Circuit Board Copper Foil Price
The production of extremely thin copper foil has high barriers, and the products produced still need to meet many requirements of downstream lithium ion battery manufacturers. For investors, they should not only focus on the single index of thickness, not all manufacturers produce 6 μ M Copper foil is consistent, and the thinner the better.
