Taizhou Preferred Cooling Copper Foil Price
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
Taizhou Preferred Cooling Copper Foil Price
The electrolyte contains oil, paint, grease, sediment and other contaminants attached to the surface of copper foil. After being squeezed by the squeezing (water) roller, the contaminants are squeezed flat, some contaminants attach to it, and some contaminants attach to the guide roller. Because the dirt is squeezed up during the operation, the dirt has a head and a tail, and has a direction.
Taizhou Preferred Cooling Copper Foil Price
Speaking saliva splashes on the surface, and stains will appear when saliva is rolled up. A short time is a dark point, and a long time is a dark point. The size of the point is related to the saliva splashed on the copper foil.
Taizhou Preferred Cooling Copper Foil Price
Surface passivation: chromate (or chromate and zinc salt) solution is used for surface passivation (i.e. anti oxidation treatment) after the barrier layer is plated to form a complex film with chromium (or chromium zinc) as the main body on the surface, so that the copper foil will not be oxidized and discolored due to direct contact with air, and at the same time, the heat resistance of the copper foil is improved (higher zinc content, better heat resistance), The storage period of copper foil can reach 3 months.
Taizhou Preferred Cooling Copper Foil Price
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
