Shenzhen preferred pcb copper foil manufacturer
With electrolytic copper or wire return material of equal purity as raw material, it is dissolved in the solution containing copper sulfate. Electrolysis is carried out in an electrolytic cell with insoluble material as anode and cathode roller immersed in copper sulfate electrolyte at constant speed as cathode. Copper in the solution is deposited on the surface of cathode roller to form copper foil. The thickness is controlled by cathode current density and cathode roller speed. After the roller rotates out of the liquid level, it is continuously stripped from the cathode roll, washed, dried and rolled to generate the original foil.
Shenzhen preferred pcb copper foil manufacturer
Calendered copper foil is the original foil made from copper plate by repeated rolling, and then roughened according to requirements. Due to the limitation of processing technology, its width is difficult to meet the requirements of rigid copper clad laminate, so calendered copper foil is rarely used on rigid copper clad laminate; However, because the bending resistance and elastic coefficient are greater than electrolytic copper foil, they are often used on flexible copper clad laminate.
Shenzhen preferred pcb copper foil manufacturer
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality. In addition, the different requirements of customers have also resulted in the waste of many intermediate products copper foil in manufacturing. The one-time input-output ratio is even less than 80%, and these copper foils have to be manufactured again, wasting resources.
Shenzhen preferred pcb copper foil manufacturer
Copper foil can be divided into many kinds according to different classifications. According to the thickness, it can be divided into: thickness (more than 70 μ m) Regular thickness copper foil (more than 18 μ M but less than 70 μ m) Thin copper foil (more than 12 μ M but less than 18 μ m) Ultra thin copper foil (less than 12 μ m) Etc.
Shenzhen preferred pcb copper foil manufacturer
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
Shenzhen preferred pcb copper foil manufacturer
Galvanizing barrier layer: After the rough surface is galvanized, a barrier layer is formed to improve the oxidation resistance of the copper foil in natural air. After galvanizing, the appearance will look gray. After a period of storage, the gray will turn into copper yellow. The more zinc is plated, the more yellow the copper foil will be.
