Huai'an optimized lithium copper foil processing
Copper foil is a key conductive material in lithium ion batteries and printed circuit boards. It is a kind of negative electrolytic material, a thin, continuous metal foil deposited on the substrate of circuit board.
Huai'an optimized lithium copper foil processing
Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.
Huai'an optimized lithium copper foil processing
The production of extremely thin copper foil has high barriers, and the products produced still need to meet many requirements of downstream lithium ion battery manufacturers. For investors, they should not only focus on the single index of thickness, not all manufacturers produce 6 μ M Copper foil is consistent, and the thinner the better.
Huai'an optimized lithium copper foil processing
If the surface stain is caused by environmental problems, the cleaning and improvement of the air conditioning filter system should be strengthened, or the wind speed should be reduced, and the small hairs on the air conditioning filter bag must be completely removed. And the fibers and powders on the polymer materials must be completely removed, which are very easy to cause stains. The air supply pipeline is easy to use plastic material, which does not produce fiber and is easy to clean with water, acid and alkali.
Huai'an optimized lithium copper foil processing
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
