Lishui Optimized Electronic Copper Foil Processing
In order to improve the adhesion strength of copper foil to the substrate, Generally, oxidation (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is generated on the surface, which improves the bonding strength of the copper foil and the substrate due to the polarity) or roughening copper foil (using electrochemical methods to generate a layer of roughening layer on the surface of the copper foil, which increases the surface area of the copper foil, and improves the bonding strength of the copper foil and the substrate due to the anchoring effect of the roughening layer on the substrate) is used.
Lishui Optimized Electronic Copper Foil Processing
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above is required to be 300ram × No more than 8 penetration points within 300mm area; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
Lishui Optimized Electronic Copper Foil Processing
Galvanizing barrier layer: After the rough surface is galvanized, a barrier layer is formed to improve the oxidation resistance of the copper foil in natural air. After galvanizing, the appearance will look gray. After a period of storage, the gray will turn into copper yellow. The more zinc is plated, the more yellow the copper foil will be.
Lishui Optimized Electronic Copper Foil Processing
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Lishui Optimized Electronic Copper Foil Processing
The foil of the clad plate can be copper, nickel, aluminum and other metal foils. However, considering such factors as the conductivity, solderability, elongation, adhesion to the substrate and price of gold, it is considered appropriate except for special purposes.
Lishui Optimized Electronic Copper Foil Processing
The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.
