Zhongshan preferred heat dissipation copper foil processing
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
Zhongshan preferred heat dissipation copper foil processing
Electrolytic copper foil is made by dissolving copper into copper sulfate solution, electrodepositing the copper sulfate electrolyte under the action of direct current in special electrolytic equipment to make the original foil, and then carrying out surface treatment, heat-resistant layer treatment, oxidation prevention treatment and other surface treatment processes on the original foil according to customer requirements.
Zhongshan preferred heat dissipation copper foil processing
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above is required to be 300ram × No more than 8 penetration points within 300mm area; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
Zhongshan preferred heat dissipation copper foil processing
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
