Fuzhou Preferred Circuit Board Copper Foil Price
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Fuzhou Preferred Circuit Board Copper Foil Price
In order to improve the bonding strength of copper foil to the substrate, oxidation is usually used (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is formed on the surface, which improves the bonding strength of copper foil and substrate due to the polarity) Or roughen the copper foil (a roughened layer is generated on the surface of the copper foil by electrochemical method, which increases the surface area of the copper foil and improves the bonding strength between the copper foil and the substrate due to the anchoring effect of the roughened layer on the substrate).
Fuzhou Preferred Circuit Board Copper Foil Price
Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.
Fuzhou Preferred Circuit Board Copper Foil Price
The electrolyte contains oil, paint, grease, sediment and other contaminants attached to the surface of copper foil. After being squeezed by the squeezing (water) roller, the contaminants are squeezed flat, some contaminants attach to it, and some contaminants attach to the guide roller. Because the dirt is squeezed up during the operation, the dirt has a head and a tail, and has a direction.
Fuzhou Preferred Circuit Board Copper Foil Price
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality.
