上海花千坊爱上海

Article publishing
Home page > Article publishing > Chaozhou Optimal Processing of Double Conductive Copper Foil

Chaozhou Optimal Processing of Double Conductive Copper Foil

Published on: January 30, 2024 00:25:07
 Chaozhou Optimal Processing of Double Conductive Copper Foil

Chaozhou Optimal Processing of Double Conductive Copper Foil

Although the thickness of copper foil gradually becomes thinner, power battery manufacturers use 6 μ When the product is less than or equal to m, the coating machine, winding machine and other key equipment as well as the technological level cannot solve the problems such as wrinkles, belt breakage and high-temperature oxidation encountered in the production process, which leads to the inability to mass produce ultra-thin copper foil with high yield.

 Chaozhou Optimal Processing of Double Conductive Copper Foil

Chaozhou Optimal Processing of Double Conductive Copper Foil

Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.

 Chaozhou Optimal Processing of Double Conductive Copper Foil

Chaozhou Optimal Processing of Double Conductive Copper Foil

Copper foil can also be divided into: single-sided treatment (single-sided hair), double-sided treatment (double-sided thick), smooth treatment (double-sided hair), double-sided light copper foil (double-sided hair) and very low profile copper foil (VLP copper foil) according to the surface condition. Post copper foil can be divided into electrolytic copper foil and calendered copper foil according to different production methods.

 Chaozhou Optimal Processing of Double Conductive Copper Foil

Chaozhou Optimal Processing of Double Conductive Copper Foil

Speaking saliva splashes on the surface, and stains will appear when saliva is rolled up. A short time is a dark point, and a long time is a dark point. The size of the point is related to the saliva splashed on the copper foil.