Huai'an chooses pcb copper foil price
High end lithium battery copper foil needs to meet the requirements of high energy density, high safety, lightweight and other characteristics of power batteries, which is also the development trend of power batteries in the future. In order to meet the above characteristics, thinner lithium copper foil means smaller resistance, so the energy density and other performance of the battery will be improved. Moreover, the thinner the copper foil of lithium battery is, the lighter the weight of the corresponding battery will be.
Huai'an chooses pcb copper foil price
At the same time of thinning, it is also necessary to improve the tensile strength, elongation and other indicators, otherwise it is easy to cause copper foil fracture, affecting the safety of the battery. Therefore, it is the general trend that the future use will be more light and meet the above indicators.
Huai'an chooses pcb copper foil price
Calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than those of electrolytic copper foil, and the copper purity is also higher than that of electrolytic copper foil.
Huai'an chooses pcb copper foil price
The foil of the clad plate can be copper, nickel, aluminum and other metal foils. However, considering such factors as the conductivity, solderability, elongation, adhesion to the substrate and price of gold, it is considered appropriate except for special purposes.
Huai'an chooses pcb copper foil price
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
