Hangzhou Optimized Anti static Copper Foil Processing
Most copper foils used for domestic printed boards are 35um thick, and 50um copper foils are used as transition products. In high-precision hole metallized double-sided or multilayer board manufacturing, thinner than 35um copper foils, such as 18um, 9um and 5um copper foils, are expected. Some multilayer boards use thicker copper foil, such as 70um.
Hangzhou Optimized Anti static Copper Foil Processing
The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.
Hangzhou Optimized Anti static Copper Foil Processing
Copper foil is not a traditional metal copper product. It combines design concepts such as composite material and nano material technology, and different internal microstructures, resulting in different properties from traditional pure copper. The application of copper foil mainly focuses on the characteristics of conduction, heat conduction and electromagnetic wave shielding.
Hangzhou Optimized Anti static Copper Foil Processing
According to the burning degree of the substrate in the flame and after leaving the ignition source, it can be divided into general type and self extinguishing type; According to the bending degree of the substrate, it can be divided into rigid and flexible laminates; According to the working temperature and working environment conditions of the substrate, it can be divided into heat resistant, radiation resistant, high-frequency foil clad plate, etc. In addition, there are also laminates used in special occasions, such as prefabricated inner laminates, metal based laminates, and copper foil, nickel foil, silver foil, aluminum foil, Kang copper foil, beryllium copper foil laminates according to the type of foil.
Hangzhou Optimized Anti static Copper Foil Processing
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
