Huainan optimized copper foil processing for circuit board
With electrolytic copper or wire return material of equal purity as raw material, it is dissolved in the solution containing copper sulfate. Electrolysis is carried out in an electrolytic cell with insoluble material as anode and cathode roller immersed in copper sulfate electrolyte at constant speed as cathode. Copper in the solution is deposited on the surface of cathode roller to form copper foil. The thickness is controlled by cathode current density and cathode roller speed. After the roller rotates out of the liquid level, it is continuously stripped from the cathode roll, washed, dried and rolled to generate the original foil.
Huainan optimized copper foil processing for circuit board
The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the principle of plastic processing. Its internal structure is lamellar crystal structure, and the product has good ductility. At present, it is mainly used in the production of rigid circuit boards, while the rolled copper foil is mainly used in flexible and high-frequency circuit boards.
Huainan optimized copper foil processing for circuit board
At the same time of thinning, it is also necessary to improve the tensile strength, elongation and other indicators, otherwise it is easy to cause copper foil fracture, affecting the safety of the battery. Therefore, it is the general trend that the future use will be more light and meet the above indicators.
Huainan optimized copper foil processing for circuit board
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Huainan optimized copper foil processing for circuit board
Electrolytic copper foil is made by dissolving copper into copper sulfate solution, electrodepositing the copper sulfate electrolyte under the action of direct current in special electrolytic equipment to make the original foil, and then carrying out surface treatment, heat-resistant layer treatment, oxidation prevention treatment and other surface treatment processes on the original foil according to customer requirements.
