Shantou Preferred Circuit Board Copper Foil Price
The surface of the copper foil shall be smooth and clean without obvious wrinkles, oxidation spots, scratches, pitting, pits and stains. The porosity of 305g/m2 and above shall not exceed 8 penetration points within the area of 300ram × 300mm; The total area of pores on an area of 0.5m2 shall not exceed the circular area with a diameter of 0.125mm.
Shantou Preferred Circuit Board Copper Foil Price
The technical feature of electrolytic copper foil is that various technical conditions in electrolyte and additives must be strictly controlled, so equipment alone is not enough to produce high-performance copper foil; High performance has high requirements for the materials of anode plate and cathode roll in the raw foil equipment, the processing accuracy and consistency of the equipment; In the production process, the concentration of copper and acid in the electrolyte needs to be monitored and adjusted in real time.
Shantou Preferred Circuit Board Copper Foil Price
Electrolytic copper foil is made by dissolving copper into copper sulfate solution, electrodepositing the copper sulfate electrolyte under the action of direct current in special electrolytic equipment to make the original foil, and then carrying out surface treatment, heat-resistant layer treatment, oxidation prevention treatment and other surface treatment processes on the original foil according to customer requirements.
Shantou Preferred Circuit Board Copper Foil Price
With the further competition in the market, even those with high added value have to be controlled from the production cost. Because the production requires very strict cleanliness of its electrolytic solution (copper sulfate solution), many filtration systems and liquid feeding pumps are repeatedly used in previous production processes. A new process flow is provided here, which can fundamentally control product quality and reduce production costs.
Shantou Preferred Circuit Board Copper Foil Price
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
