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Xinyu Optimized Electrolytic Copper Foil Processing

Release time: December 31, 2023 00:24:57
 Xinyu Optimized Electrolytic Copper Foil Processing

Xinyu Optimized Electrolytic Copper Foil Processing

The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality. In addition, the different requirements of customers have also resulted in the waste of many intermediate products copper foil in manufacturing. The one-time input-output ratio is even less than 80%, and these copper foils have to be manufactured again, wasting resources.

 Xinyu Optimized Electrolytic Copper Foil Processing

Xinyu Optimized Electrolytic Copper Foil Processing

Backward key production equipment: for high-quality products with production thickness less than 0.05mm, multi roll rolling mill with width meeting user requirements shall be used. The rolling mill of some domestic copper processing plants can not be normally put into rolling foil production due to the lack of other equipment or the traditional product structure in the factory. However, some small processing plants have to use outdated production equipment and processes due to lack of key equipment or investment capacity, and copper foil product specifications and technical indicators are inferior to foreign products.

 Xinyu Optimized Electrolytic Copper Foil Processing

Xinyu Optimized Electrolytic Copper Foil Processing

The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.

 Xinyu Optimized Electrolytic Copper Foil Processing

Xinyu Optimized Electrolytic Copper Foil Processing

Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.

 Xinyu Optimized Electrolytic Copper Foil Processing

Xinyu Optimized Electrolytic Copper Foil Processing

Definition of electrolytic copper foil: it is formed by depositing copper ions in electrolyte on the round cathode roller of smooth rotating stainless steel plate (or titanium plate). The surface close to the cathode roller is called smooth surface, and the other surface is called rough surface.

 Xinyu Optimized Electrolytic Copper Foil Processing

Xinyu Optimized Electrolytic Copper Foil Processing

At the same time of thinning, it is also necessary to improve the tensile strength, elongation and other indicators, otherwise it is easy to cause copper foil fracture, affecting the safety of the battery. Therefore, it is the general trend that the future use will be more light and meet the above indicators.