Yancheng optimized ultra-thin copper foil processing
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Yancheng optimized ultra-thin copper foil processing
Copper foil can be divided into many kinds according to different classifications. According to the thickness, it can be divided into: thickness (more than 70 μ m) Regular thickness copper foil (more than 18 μ M but less than 70 μ m) Thin copper foil (more than 12 μ M but less than 18 μ m) Ultra thin copper foil (less than 12 μ m) Etc.
Yancheng optimized ultra-thin copper foil processing
During the production of copper foil, tiny foreign matters are adhered on the surface to form spots with different colors from the surface, which are called stains. Judgment method: use macroscopic inspection to judge whether it is a waste product, a secondary product or a finished product according to the number and area of stains and the impact on product quality.
Yancheng optimized ultra-thin copper foil processing
The technical feature of electrolytic copper foil is that various technical conditions in electrolyte and additives must be strictly controlled, so equipment alone is not enough to produce high-performance copper foil; High performance has high requirements for the materials of anode plate and cathode roll in the raw foil equipment, the processing accuracy and consistency of the equipment; In the production process, the concentration of copper and acid in the electrolyte needs to be monitored and adjusted in real time.
