Anqing Optimized Rolling Copper Foil Processing
Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.
Anqing Optimized Rolling Copper Foil Processing
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality.
Anqing Optimized Rolling Copper Foil Processing
Most copper foils used for domestic printed boards are 35um thick, and 50um copper foils are used as transition products. In high-precision hole metallized double-sided or multilayer board manufacturing, thinner than 35um copper foils, such as 18um, 9um and 5um copper foils, are expected. Some multilayer boards use thicker copper foil, such as 70um.
Anqing Optimized Rolling Copper Foil Processing
In order to improve the adhesion strength of copper foil to the substrate, Generally, oxidation (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is generated on the surface, which improves the bonding strength of the copper foil and the substrate due to the polarity) or roughening copper foil (using electrochemical methods to generate a layer of roughening layer on the surface of the copper foil, which increases the surface area of the copper foil, and improves the bonding strength of the copper foil and the substrate due to the anchoring effect of the roughening layer on the substrate) is used.
