Foshan preferred pcb copper foil processing
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
Foshan preferred pcb copper foil processing
Backward key production equipment: for high-quality products with production thickness less than 0.05mm, multi roll rolling mill with width meeting user requirements shall be used. The rolling mill of some domestic copper processing plants can not be normally put into rolling foil production due to the lack of other equipment or the traditional product structure in the factory. However, some small processing plants have to use outdated production equipment and processes due to lack of key equipment or investment capacity, and copper foil product specifications and technical indicators are inferior to foreign products.
Foshan preferred pcb copper foil processing
Silane coupling agent treatment: after anti oxidation treatment, the surface is sprayed with silane, which can improve the oxidation resistance at room temperature on the one hand; On the other hand, in high temperature pressing plate, silane can better combine copper foil and resin substrate through coupling, and improve peel strength. Post treatment process - drying. In order to prevent the harm of residual moisture, it must be dried at not less than 100 ℃ later, and the drying temperature cannot be too high.
Foshan preferred pcb copper foil processing
The foil of the clad plate can be copper, nickel, aluminum and other metal foils. However, considering such factors as the conductivity, solderability, elongation, adhesion to the substrate and price of gold, it is considered appropriate except for special purposes.
Foshan preferred pcb copper foil processing
Copper foil is an indispensable raw material for making printed circuit board (PCB), copper clad plate (CCL) and lithium-ion battery. For industrial use, it can be divided into calendered copper foil and two categories according to its manufacturing process. Electrolytic copper foil is made by electrolysis of copper based on electrochemical principle. The internal structure of raw foil is vertical acicular crystal structure, and its production cost is relatively low.
