Chaozhou Optimized Electrolytic Copper Foil Processing
With electrolytic copper or wire return material of equal purity as raw material, it is dissolved in the solution containing copper sulfate. Electrolysis is carried out in an electrolytic cell with insoluble material as anode and cathode roller immersed in copper sulfate electrolyte at constant speed as cathode. Copper in the solution is deposited on the surface of cathode roller to form copper foil. The thickness is controlled by cathode current density and cathode roller speed. After the roller rotates out of the liquid level, it is continuously stripped from the cathode roll, washed, dried and rolled to generate the original foil.
Chaozhou Optimized Electrolytic Copper Foil Processing
Galvanizing barrier layer: After the rough surface is galvanized, a barrier layer is formed to improve the oxidation resistance of the copper foil in natural air. After galvanizing, the appearance will look gray. After a period of storage, the gray will turn into copper yellow. The more zinc is plated, the more yellow the copper foil will be.
Chaozhou Optimized Electrolytic Copper Foil Processing
Copper foil can also be divided into: single-sided treatment (single-sided hair), double-sided treatment (double-sided thick), smooth treatment (double-sided hair), double-sided light copper foil (double-sided hair) and very low profile copper foil (VLP copper foil) according to the surface condition. Post copper foil can be divided into electrolytic copper foil and calendered copper foil according to different production methods.
Chaozhou Optimized Electrolytic Copper Foil Processing
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
