Hefei Optimized Double Conductive Copper Foil Processing
Copper foil is a key conductive material in lithium ion batteries and printed circuit boards. It is a kind of negative electrolytic material, a thin, continuous metal foil deposited on the substrate of circuit board.
Hefei Optimized Double Conductive Copper Foil Processing
High end lithium battery copper foil needs to meet the requirements of high energy density, high safety, lightweight and other characteristics of power batteries, which is also the development trend of power batteries in the future. In order to meet the above characteristics, thinner lithium copper foil means smaller resistance, so the energy density and other performance of the battery will be improved. Moreover, the thinner the copper foil of lithium battery is, the lighter the weight of the corresponding battery will be.
Hefei Optimized Double Conductive Copper Foil Processing
The electrolyte contains oil, paint, grease, sediment and other contaminants attached to the surface of copper foil. After being squeezed by the squeezing (water) roller, the contaminants are squeezed flat, some contaminants attach to it, and some contaminants attach to the guide roller. Because the dirt is squeezed up during the operation, the dirt has a head and a tail, and has a direction.
Hefei Optimized Double Conductive Copper Foil Processing
During the production of copper foil, tiny foreign matters are adhered on the surface to form spots with different colors from the surface, which are called stains. Judgment method: use macroscopic inspection to judge whether it is a waste product, a secondary product or a finished product according to the number and area of stains and the impact on product quality.
Hefei Optimized Double Conductive Copper Foil Processing
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
Hefei Optimized Double Conductive Copper Foil Processing
Silane coupling agent treatment: after anti oxidation treatment, the surface is sprayed with silane, which can improve the oxidation resistance at room temperature on the one hand; On the other hand, in high temperature pressing plate, silane can better combine copper foil and resin substrate through coupling, and improve peel strength. Post treatment process - drying. In order to prevent the harm of residual moisture, it must be dried at not less than 100 ℃ later, and the drying temperature cannot be too high.
