Huangshan Optimized Rolling Copper Foil Processing
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
Huangshan Optimized Rolling Copper Foil Processing
If the rough surface and pinholes appear at the same time when there are stains on the rough surface, it indicates that the stains are caused by the dirty electrolyte, and the dirt is attached to the copper foil in the electrolytic cell. If there are stains on the rough surface, the copper foil is not rough and there are no pinholes, it means that the workshop production environment is dirty, the air contains dust, or other suspended impurities fall on the surface of the copper foil.
Huangshan Optimized Rolling Copper Foil Processing
Copper foil is not a traditional metal copper product. It combines design concepts such as composite material and nano material technology, and different internal microstructures, resulting in different properties from traditional pure copper. The application of copper foil mainly focuses on the characteristics of conduction, heat conduction and electromagnetic wave shielding.
Huangshan Optimized Rolling Copper Foil Processing
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
