Fuyang Optimized Electronic Copper Foil Processing
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
Fuyang Optimized Electronic Copper Foil Processing
With the further competition in the market, even those with high added value have to be controlled from the production cost. Because the production requires very strict cleanliness of its electrolytic solution (copper sulfate solution), many filtration systems and liquid feeding pumps are repeatedly used in previous production processes. A new process flow is provided here, which can fundamentally control product quality and reduce production costs.
Fuyang Optimized Electronic Copper Foil Processing
The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.
Fuyang Optimized Electronic Copper Foil Processing
Backward key production equipment: for high-quality products with production thickness less than 0.05mm, multi roll rolling mill with width meeting user requirements shall be used. The rolling mill of some domestic copper processing plants can not be normally put into rolling foil production due to the lack of other equipment or the traditional product structure in the factory. However, some small processing plants have to use outdated production equipment and processes due to lack of key equipment or investment capacity, and copper foil product specifications and technical indicators are inferior to foreign products.
Fuyang Optimized Electronic Copper Foil Processing
Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.
