Heyuan optimized conductive copper foil processing
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
Heyuan optimized conductive copper foil processing
The commonly used reinforcement materials of copper clad laminate are alkali free (alkali metal oxide content shall not exceed 0.5%) glass fiber products (such as glass cloth, glass felt) or paper (such as wood pulp paper, bleached wood pulp paper, cotton wool paper). Therefore, laminates can be divided into glass cloth base and paper base.
Heyuan optimized conductive copper foil processing
Definition of electrolytic copper foil: it is formed by depositing copper ions in electrolyte on the round cathode roller of smooth rotating stainless steel plate (or titanium plate). The surface close to the cathode roller is called smooth surface, and the other surface is called rough surface.
Heyuan optimized conductive copper foil processing
Copper foil can also be divided into: single-sided treatment (single-sided hair), double-sided treatment (double-sided thick), smooth treatment (double-sided hair), double-sided light copper foil (double-sided hair) and very low profile copper foil (VLP copper foil) according to the surface condition. Post copper foil can be divided into electrolytic copper foil and calendered copper foil according to different production methods.
Heyuan optimized conductive copper foil processing
Copper foil is an indispensable raw material for making printed circuit board (PCB), copper clad plate (CCL) and lithium-ion battery. For industrial use, it can be divided into calendered copper foil and two categories according to its manufacturing process. Electrolytic copper foil is made by electrolysis of copper based on electrochemical principle. The internal structure of raw foil is vertical acicular crystal structure, and its production cost is relatively low.
Heyuan optimized conductive copper foil processing
The foil of the clad plate can be copper, nickel, aluminum and other metal foils. However, considering such factors as the conductivity, solderability, elongation, adhesion to the substrate and price of gold, it is considered appropriate except for special purposes.
