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Shanwei Preferred Copper Foil Manufacturer

Release time: 2023-11-07 00:25:19
 Shanwei Preferred Copper Foil Manufacturer

Shanwei Preferred Copper Foil Manufacturer

At the same time of thinning, it is also necessary to improve the tensile strength, elongation and other indicators, otherwise it is easy to cause copper foil fracture, affecting the safety of the battery. Therefore, it is the general trend that the future use will be more light and meet the above indicators.

 Shanwei Preferred Copper Foil Manufacturer

Shanwei Preferred Copper Foil Manufacturer

The copper foil industry belongs to the copper processing industry, which processes copper into extremely thin copper strips or sheets by means of rolling, electrolysis and sputtering, and further applies them as industrial raw materials in various downstream products. The thickness of μ Below m, the thickness varies depending on the scene used.

 Shanwei Preferred Copper Foil Manufacturer

Shanwei Preferred Copper Foil Manufacturer

Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.

 Shanwei Preferred Copper Foil Manufacturer

Shanwei Preferred Copper Foil Manufacturer

With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.