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Bozhou Optimized Ultra thin Copper Foil Processing

Release time: 2023-10-30 00:25:21
 Bozhou Optimized Ultra thin Copper Foil Processing

Bozhou Optimized Ultra thin Copper Foil Processing

Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.

 Bozhou Optimized Ultra thin Copper Foil Processing

Bozhou Optimized Ultra thin Copper Foil Processing

Copper foil can also be divided into: single-sided treatment (single-sided hair), double-sided treatment (double-sided thick), smooth treatment (double-sided hair), double-sided light copper foil (double-sided hair) and very low profile copper foil (VLP copper foil) according to the surface condition. Post copper foil can be divided into electrolytic copper foil and calendered copper foil according to different production methods.

 Bozhou Optimized Ultra thin Copper Foil Processing

Bozhou Optimized Ultra thin Copper Foil Processing

Calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than those of electrolytic copper foil, and the copper purity is also higher than that of electrolytic copper foil.

 Bozhou Optimized Ultra thin Copper Foil Processing

Bozhou Optimized Ultra thin Copper Foil Processing

Copper clad laminate is the base plate for manufacturing PCB, which is an important type with large amount of materials. The manufacturing process of copper clad laminate is to impregnate glass fiber cloth, glass fiber mat, paper and other reinforcement materials with epoxy resin, phenolic resin and other adhesives, dry them to the first stage at appropriate temperature, obtain pre impregnating materials (referred to as impregnating materials), and then stack them according to process requirements and copper foil, The required copper clad laminate is obtained by heating and pressurizing on the laminator.

 Bozhou Optimized Ultra thin Copper Foil Processing

Bozhou Optimized Ultra thin Copper Foil Processing

With electrolytic copper or wire return material of equal purity as raw material, it is dissolved in the solution containing copper sulfate. Electrolysis is carried out in an electrolytic cell with insoluble material as anode and cathode roller immersed in copper sulfate electrolyte at constant speed as cathode. Copper in the solution is deposited on the surface of cathode roller to form copper foil. The thickness is controlled by cathode current density and cathode roller speed. After the roller rotates out of the liquid level, it is continuously stripped from the cathode roll, washed, dried and rolled to generate the original foil.

 Bozhou Optimized Ultra thin Copper Foil Processing

Bozhou Optimized Ultra thin Copper Foil Processing

The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.