Xuzhou Chosen Electrolytic Copper Foil Manufacturers
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality. In addition, the different requirements of customers have also resulted in the waste of many intermediate products copper foil in manufacturing. The one-time input-output ratio is even less than 80%, and these copper foils have to be manufactured again, wasting resources.
Xuzhou Chosen Electrolytic Copper Foil Manufacturers
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
Xuzhou Chosen Electrolytic Copper Foil Manufacturers
If the rough surface and pinholes appear at the same time when there are stains on the rough surface, it indicates that the stains are caused by the dirty electrolyte, and the dirt is attached to the copper foil in the electrolytic cell. If there are stains on the rough surface, the copper foil is not rough and there are no pinholes, it means that the workshop production environment is dirty, the air contains dust, or other suspended impurities fall on the surface of the copper foil.
Xuzhou Chosen Electrolytic Copper Foil Manufacturers
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
