Changzhou Optimized Double Conductive Copper Foil Processing
Curing treatment: deposit a layer of dense metal copper in the nodular particle gap of the roughening layer, increase the contact surface between the roughening layer and the wool foil substrate, and reduce the roughness of the roughening layer surface. Microscopically, after rough surface roughening treatment, the foil surface is uneven and undulating greatly, while after curing treatment, the copper foil surface is relatively flat. After curing treatment, although the roughness is reduced, the bonding strength between the treatment layer and the insulating substrate material is improved due to the increased contact area between the roughened layer and the wool foil, which fundamentally eliminates the delamination between the treatment layer and the wool foil.
Changzhou Optimized Double Conductive Copper Foil Processing
Although the thickness of copper foil gradually becomes thinner, power battery manufacturers use 6 μ When the product is less than or equal to m, the coating machine, winding machine and other key equipment as well as the technological level cannot solve the problems such as wrinkles, belt breakage and high-temperature oxidation encountered in the production process, which leads to the inability to mass produce ultra-thin copper foil with high yield.
Changzhou Optimized Double Conductive Copper Foil Processing
Electrolytic copper foil is made by dissolving copper into copper sulfate solution, electrodepositing the copper sulfate electrolyte under the action of direct current in special electrolytic equipment to make the original foil, and then carrying out surface treatment, heat-resistant layer treatment, oxidation prevention treatment and other surface treatment processes on the original foil according to customer requirements.
Changzhou Optimized Double Conductive Copper Foil Processing
In order to avoid the copper oxide powder falling off and moving to the substrate, the surface treatment method has also been constantly improved. For example, TW copper foil is coated with a thin layer of zinc on the roughened surface of the copper foil, and the surface is gray; TC type copper foil is coated with a thin layer of copper zinc alloy on the roughened surface of the copper foil. At this time, the surface of the copper foil is golden yellow. After special treatment, the thermal discoloration resistance, oxidation resistance and cyanide resistance of copper foil in PCB manufacturing are improved accordingly.
