Beijing Preferred Circuit Board Copper Foil Price
Calendered copper foil is the original foil made from copper plate by repeated rolling, and then roughened according to requirements. Due to the limitation of processing technology, its width is difficult to meet the requirements of rigid copper clad laminate, so calendered copper foil is rarely used on rigid copper clad laminate; However, because the bending resistance and elastic coefficient are greater than electrolytic copper foil, they are often used on flexible copper clad laminate.
Beijing Preferred Circuit Board Copper Foil Price
Although the thickness of copper foil gradually becomes thinner, power battery manufacturers use 6 μ When the product is less than or equal to m, the coating machine, winding machine and other key equipment as well as the technological level cannot solve the problems such as wrinkles, belt breakage and high-temperature oxidation encountered in the production process, which leads to the inability to mass produce ultra-thin copper foil with high yield.
Beijing Preferred Circuit Board Copper Foil Price
Copper foil is divided into calendered copper foil and electrolytic copper foil according to the preparation process, which accounts for the vast majority of the market. According to the Copper Foil Branch of China Electricity Association (CCFA), at present, domestic manufacturers mainly focus on the production of electrolytic copper foil. In 19 years, the domestic production capacity of electrolytic copper foil is expected to be close to 600000 tons, while that of rolled copper foil is only about 10000 tons.
Beijing Preferred Circuit Board Copper Foil Price
In order to improve the bonding strength of copper foil to the substrate, oxidation is usually used (that is, after oxidation treatment, a layer of copper oxide or cuprous oxide is formed on the surface, which improves the bonding strength of copper foil and substrate due to the polarity) Or roughen the copper foil (a roughened layer is generated on the surface of the copper foil by electrochemical method, which increases the surface area of the copper foil and improves the bonding strength between the copper foil and the substrate due to the anchoring effect of the roughened layer on the substrate).
Beijing Preferred Circuit Board Copper Foil Price
With the further competition in the market, even those with high added value have to be controlled from the production cost. Because the production requires very strict cleanliness of its electrolytic solution (copper sulfate solution), many filtration systems and liquid feeding pumps are repeatedly used in previous production processes. A new process flow is provided here, which can fundamentally control product quality and reduce production costs.
