Suzhou Preferred Cooling Copper Foil Price
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
Suzhou Preferred Cooling Copper Foil Price
Calendered copper foil is a product made by repeatedly rolling and annealing high-precision copper strip (usually less than 150 microns in thickness) based on the principle of plastic processing (usually 4-100 microns in thickness and<800 mm in width). Its ductility, bending resistance and conductivity are better than those of electrolytic copper foil, and the copper purity is also higher than that of electrolytic copper foil.
Suzhou Preferred Cooling Copper Foil Price
According to the burning degree of the substrate in the flame and after leaving the ignition source, it can be divided into general type and self extinguishing type; According to the bending degree of the substrate, it can be divided into rigid and flexible laminates; According to the working temperature and working environment conditions of the substrate, it can be divided into heat resistant, radiation resistant, high-frequency foil clad plate, etc. In addition, there are also laminates used in special occasions, such as prefabricated inner laminates, metal based laminates, and copper foil, nickel foil, silver foil, aluminum foil, Kang copper foil, beryllium copper foil laminates according to the type of foil.
Suzhou Preferred Cooling Copper Foil Price
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
