Huaibei selects the best copper foil manufacturer
If the rough surface and pinholes appear at the same time when there are stains on the rough surface, it indicates that the stains are caused by the dirty electrolyte, and the dirt is attached to the copper foil in the electrolytic cell. If there are stains on the rough surface, the copper foil is not rough and there are no pinholes, it means that the workshop production environment is dirty, the air contains dust, or other suspended impurities fall on the surface of the copper foil.
Huaibei selects the best copper foil manufacturer
The electrolyte contains oil, paint, grease, sediment and other contaminants attached to the surface of copper foil. After being squeezed by the squeezing (water) roller, the contaminants are squeezed flat, some contaminants attach to it, and some contaminants attach to the guide roller. Because the dirt is squeezed up during the operation, the dirt has a head and a tail, and has a direction.
Huaibei selects the best copper foil manufacturer
The air supply of general air conditioning has a large impact. For the stains caused by the dirty electrolyte, the filtering of electrolyte should be strengthened. After being transferred from the electrolytic cell, the copper foil must be washed with electrolyte, because the surface of the copper foil is attached with organic matter or other impurities. The water pressure of copper foil washing must have enough pressure and a certain amount of water.
Huaibei selects the best copper foil manufacturer
Electrolytic copper foil is made by dissolving copper into copper sulfate solution, electrodepositing the copper sulfate electrolyte under the action of direct current in special electrolytic equipment to make the original foil, and then carrying out surface treatment, heat-resistant layer treatment, oxidation prevention treatment and other surface treatment processes on the original foil according to customer requirements.
Huaibei selects the best copper foil manufacturer
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
