Jingdezhen Preferred Circuit Board Copper Foil Price
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality. In addition, the different requirements of customers have also resulted in the waste of many intermediate products copper foil in manufacturing. The one-time input-output ratio is even less than 80%, and these copper foils have to be manufactured again, wasting resources.
Jingdezhen Preferred Circuit Board Copper Foil Price
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
Jingdezhen Preferred Circuit Board Copper Foil Price
Calendered copper foil products have good ductility, flexibility, low roughness and high folding resistance, and have become the basic materials of flexible printed circuit boards, mainly used in flexible circuit boards and high-frequency circuit boards.
Jingdezhen Preferred Circuit Board Copper Foil Price
The calendered copper foil is made by repeated rolling annealing process of copper ingot based on the principle of plastic processing. Its internal structure is lamellar crystal structure, and the product has good ductility. At present, it is mainly used in the production of rigid circuit boards, while the rolled copper foil is mainly used in flexible and high-frequency circuit boards.
Jingdezhen Preferred Circuit Board Copper Foil Price
Surface passivation: chromate (or chromate and zinc salt) solution is used for surface passivation (i.e. anti oxidation treatment) after the barrier layer is plated to form a complex film with chromium (or chromium zinc) as the main body on the surface, so that the copper foil will not be oxidized and discolored due to direct contact with air, and at the same time, the heat resistance of the copper foil is improved (higher zinc content, better heat resistance), The storage period of copper foil can reach 3 months.
