Beijing Chosen Electrolytic Copper Foil Manufacturers
The copper clad laminate is composed of copper foil, reinforcement material and adhesive. Plates are usually classified according to the reinforcement material category and adhesive category or plate characteristics.
Beijing Chosen Electrolytic Copper Foil Manufacturers
If the rough surface and pinholes appear at the same time when there are stains on the rough surface, it indicates that the stains are caused by the dirty electrolyte, and the dirt is attached to the copper foil in the electrolytic cell. If there are stains on the rough surface, the copper foil is not rough and there are no pinholes, it means that the workshop production environment is dirty, the air contains dust, or other suspended impurities fall on the surface of the copper foil.
Beijing Chosen Electrolytic Copper Foil Manufacturers
The production process of electrolytic copper foil is simple. There are three main processes: solution raw foil, surface treatment and product slitting. The production process seems simple, but it is a production process that integrates electronics, machinery and electrochemistry, and is particularly strict with the production environment. Therefore, the industry does not have a set of standard and universal production equipment and technology, and each manufacturer shows its own ingenuity, which is also an important bottleneck affecting the improvement of domestic production capacity and quality. In addition, the different requirements of customers have also resulted in the waste of many intermediate products copper foil in manufacturing. The one-time input-output ratio is even less than 80%, and these copper foils have to be manufactured again, wasting resources.
Beijing Chosen Electrolytic Copper Foil Manufacturers
The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.
Beijing Chosen Electrolytic Copper Foil Manufacturers
The ultra-thin copper foil, represented by mobile phones and laptops, is promoted to thin foil and ultra-thin foil types for portable electronic products, including micro buried, blind hole L multilayer boards, and BGA, CSP and other organic resin packaging substrates. At the same time, COz laser etching also requires the substrate to be extremely thin, so that the copper foil layer can be directly machined with micro wire holes. In Japan, the United States and other countries, electrolytic copper foils of 9 μ m, 5 μ m and 3/- tm can be industrialized. At present, the difficulty or key point of the production technology of ultra-thin copper foil is whether it can be directly produced without carrier, and the product qualification rate is high, as well as the development of new carriers.
