Optimization of Electrolytic Copper Foil Processing in Maanshan
With electrolytic copper or wire return material of equal purity as raw material, it is dissolved in the solution containing copper sulfate. Electrolysis is carried out in an electrolytic cell with insoluble material as anode and cathode roller immersed in copper sulfate electrolyte at constant speed as cathode. Copper in the solution is deposited on the surface of cathode roller to form copper foil. The thickness is controlled by cathode current density and cathode roller speed. After the roller rotates out of the liquid level, it is continuously stripped from the cathode roll, washed, dried and rolled to generate the original foil.
Optimization of Electrolytic Copper Foil Processing in Maanshan
Although the thickness of copper foil gradually becomes thinner, power battery manufacturers use 6 μ When the product is less than or equal to m, the coating machine, winding machine and other key equipment as well as the technological level cannot solve the problems such as wrinkles, belt breakage and high-temperature oxidation encountered in the production process, which leads to the inability to mass produce ultra-thin copper foil with high yield.
Optimization of Electrolytic Copper Foil Processing in Maanshan
The air supply of general air conditioning has a large impact. For the stains caused by the dirty electrolyte, the filtering of electrolyte should be strengthened. After being transferred from the electrolytic cell, the copper foil must be washed with electrolyte, because the surface of the copper foil is attached with organic matter or other impurities. The water pressure of copper foil washing must have enough pressure and a certain amount of water.
Optimization of Electrolytic Copper Foil Processing in Maanshan
The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.
Optimization of Electrolytic Copper Foil Processing in Maanshan
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
Optimization of Electrolytic Copper Foil Processing in Maanshan
Surface passivation: chromate (or chromate and zinc salt) solution is used for surface passivation (i.e. anti oxidation treatment) after the barrier layer is plated to form a complex film with chromium (or chromium zinc) as the main body on the surface, so that the copper foil will not be oxidized and discolored due to direct contact with air, and at the same time, the heat resistance of the copper foil is improved (higher zinc content, better heat resistance), The storage period of copper foil can reach 3 months.
