Anqing Preferred Battery Copper Foil Price
Foil making material requirements: the thinner the thickness is, the higher the quality grade is, and the lower the impurity content in the electrolyte is required. In order to ensure the quality, the purity of copper must be greater than 99.9%.
Anqing Preferred Battery Copper Foil Price
The copper clad laminate is composed of copper foil, reinforcement material and adhesive. Plates are usually classified according to the reinforcement material category and adhesive category or plate characteristics.
Anqing Preferred Battery Copper Foil Price
The technical feature of electrolytic copper foil is that various technical conditions in electrolyte and additives must be strictly controlled, so equipment alone is not enough to produce high-performance copper foil; High performance has high requirements for the materials of anode plate and cathode roll in the raw foil equipment, the processing accuracy and consistency of the equipment; In the production process, the concentration of copper and acid in the electrolyte needs to be monitored and adjusted in real time.
Anqing Preferred Battery Copper Foil Price
The copper foil industry belongs to the copper processing industry, which processes copper into extremely thin copper strips or sheets by means of rolling, electrolysis and sputtering, and further applies them as industrial raw materials in various downstream products. The thickness of μ Below m, the thickness varies depending on the scene used.
Anqing Preferred Battery Copper Foil Price
Electronic circuit copper foil plays an important role in conducting electricity and heat in printed circuit board (PCB), and is known as the neural network on PCB. At present, copper foil for electronic circuits (PCB copper foil) is divided into two categories, namely conventional copper foil and high-performance copper foil.
Anqing Preferred Battery Copper Foil Price
With the development of high-density wiring technology for low profile copper foil multilayer boards, the traditional type cannot meet the needs of manufacturing high-precision printed circuit boards. Therefore, a new generation of copper foils, low profile (LP) and ultra-low profile (VLP), have emerged one after another. Compared with ordinary electrolytic copper foil, LP copper foil has fine crystal (2/zm), equiaxed grains, no columnar crystals, lamellar crystals, flat prisms and low surface roughness.
