Jiujiang Chosen Double Conductive Copper Foil Manufacturer
Although the thickness of copper foil gradually becomes thinner, power battery manufacturers use 6 μ When the product is less than or equal to m, the coating machine, winding machine and other key equipment as well as the technological level cannot solve the problems such as wrinkles, belt breakage and high-temperature oxidation encountered in the production process, which leads to the inability to mass produce ultra-thin copper foil with high yield.
Jiujiang Chosen Double Conductive Copper Foil Manufacturer
Copper foil is not a traditional metal copper product. It combines design concepts such as composite material and nano material technology, and different internal microstructures, resulting in different properties from traditional pure copper. The application of copper foil mainly focuses on the characteristics of conduction, heat conduction and electromagnetic wave shielding.
Jiujiang Chosen Double Conductive Copper Foil Manufacturer
The adhesives used for the laminates mainly include phenolic, epoxy, polyester, polyimide, polytetrafluoroethylene resin, etc. Therefore, the laminates are also divided into phenolic, epoxy, polyester, polyimide, and polytetrafluoroethylene laminates.
Jiujiang Chosen Double Conductive Copper Foil Manufacturer
Galvanizing barrier layer: After the rough surface is galvanized, a barrier layer is formed to improve the oxidation resistance of the copper foil in natural air. After galvanizing, the appearance will look gray. After a period of storage, the gray will turn into copper yellow. The more zinc is plated, the more yellow the copper foil will be.
Jiujiang Chosen Double Conductive Copper Foil Manufacturer
Excellent tensile strength and elongation High tensile strength and elongation under normal conditions can improve processing ability, enhance rigidity and avoid wrinkles to improve production qualification rate. High temperature extensibility (THE) copper foil and high tensile strength copper foil at high temperature can improve the thermal stability of printed boards and avoid deformation and warpage.
